Thermal Analysis Tools (Modules 24): Engelmaier Fatigue Number of Cycles to Fail Model (see details under Engelmaier page), a number of semiconductor junction to case temperature models with and without fan cooling, RF Power Efficiency Dissipation Analysis, Thermal resistance, Heating, Time constant of material, CTE mismatch and solder joint shear stress and fatigue risks, Thermal Junction Temperature of a hermetic power device, Transient Thermal Response time, Pulse Mode Junction Temperature Rise, experimental method of finding Tau Transient Temperature Rise Time. IGBT Junction Temperature model with switching. Library of materials thermal properties.